GF120xHT Series Mass Flow Controllers for High-Temperature Environments

Supporting solid and liquid precursors required in semiconductor manufacturing, GF120xHT Series high-temperature thermal mass flow controller operates between 113 and 302°F (45 and 150°C).

With its greater operating range than conventional thermal MFCs, the GF120xHT can deliver vapor to the process chamber, even when that material is a liquid or a solid at room temperature.

It has ultrafast EtherCAT communication, programmable alarms and warnings developed for advanced process control, and fault detection and classification (FDC) tracking.

To support high-temperature applications, the electronics are remotely connected to the mechanical flow module of the GF120xHT Series. The flow module can operate at temperatures up to 150°C, while the remote electronics are mounted in a cooler location (<50°C). 

Each device is sized and calibrated to each customer's configuration based on their operating temperature, pressures, and mounting orientation.

The remote electronics are offered with a range of communication protocols (analog, DeviceNet and EtherCAT), along with a standard din rail for ease of mounting. The flow module also supports a variety of fitting options, ensuring compatibility with current and future equipment designs. In addition, 3 cable lengths are available for connecting the remote electronics to the flow module to support various applications.


  • Designed for high-temperature applications up to 150°C
  • Convenient service port provides access to diagnostics via user-friendly interface
  • Corrosion-resistant Hastelloy sensor
  • Calibrated to the customer's process conditions
  • Ability to support applications up to 150°C for liquid precursor vapor delivery
  • User-friendly diagnostics interface supports process engineer in ensuring MFC is operating within the specified limits for high-yield and maximum uptime
  • Provides unmatched long-term sensor stability for maximum throughput and yields
  • Calibrated at customer operating temperature and pressure for optimal performance


  • Advanced Strip Processes
  • Atomic Layer Deposition (ALD)
  • Deposition


Flow Range (Full Scale Capacity) 50 sccm to 5 slm (N2 equivalent)
Accuracy ±1% SP >35 to 100%; ±0.35% FS 2 to 35%
Repeatability <±0.15% SP
Response Time Normally Closed Valve: <1 sec
Seal Material Metal
Level of Purity/Surface Finish 5 µ in. Ra avg
Max. Temp. 302°F (150°C)
Max. Pressure 500 psia
Diagnostic Capability Available
Analog Communication 0 to 5V DC
Digital Communication DeviceNet, EtherCAT, RS-485 L-Protocol

Brooks Instrument
Hatfield, PA
(888) 554-3569
[email protected]

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