DuPont Pyralux ML Series Double-Sided Metal-Clad Laminates for PCBs

May 7, 2024
DuPont Pyralux ML Series of double-sided metal-clad laminates contain metal alloys to provide heating, heat transfer, heat output, and thermoelectric properties for PCBs.

DuPont Pyralux ML Series of double-sided metal-clad laminates for flexible and rigid-flex printed circuit boards (PCBs) were developed for optimal thermal management in aerospace, defense, electric vehicles (EV), artificial intelligence (AI) related networking, and other electronic devices.

The series works well in challenging environments for many different applications, addressing the challenges of thermal management for flexible printed circuits, sensors, heaters, and thermocouples.

Pyralux ML contains metal alloys, such as copper-nickel (CuNi), featuring Kapton all-polyimide dielectric technology. The alloys provide thermal resistance for heating, thermal conductivity to improve heat transfer, resistivity for heat output, and thermoelectric properties as needed for the application.

Available in a variety of dielectric and foil types, thicknesses, and a range of metal constructions, they are fully compatible with most conventional circuit fabrication processes.


DuPont
Wilmington, DE
www.dupont.com

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.