Emerson will present its portfolio of packaging automation and digital transformation technologies at PACK EXPO Las Vegas, Sept. 29–Oct. 1, 2025 (South Hall, Lower Level, Booth SL-15009). Attendees will see how the company's data-driven "Floor to Cloud" approach connects intelligent devices with advanced software to improve packaging performance, energy efficiency, and productivity.
View the slides above for a look at the full lineup of products on display at the booth.
What You’ll See at the Emerson Booth
Live Demos
Operations Control Tower: Visualization of connected assets' performance and energy use to support benchmarking and continuous improvement.
Ballpoint Pen Assembly Line: Demonstration of integrated automation components assembling and packaging a pen with a Branson Polaris Ultrasonic Welder. A QR code on the product shows energy consumed during assembly.
High-Speed Pick-and-Place: LED pick-and-place with a rotary table and gripper system, highlighting reduced energy use, faster cycles, and lower maintenance.
Presentations and Events
Innovation Stage Presentation Unlocking Energy Efficiency: Smarter Monitoring for Sustainable Growth
Date: Tuesday, Sept. 30
Time: 12 p.m.
Location: Innovation Stage 3 (W-4318)
Speaker: Silvia Gonzalez, Global Director of Software
Focus: Real-time energy monitoring for operational efficiency and emissions reduction, including a new scalable monitoring solution.
Amazing Packaging Race
Date: Wednesday, Oct. 1, at 9 a.m.
Student teams compete in packaging-related challenges across exhibitor booths.