SonoFlex Acoustic Inspection System Targets Chip Packaging Voids
Back-end semiconductor manufacturers inspecting small-panel packages need faster, more accurate ways to catch voids, cracks, and delamination without slowing production. The SonoFlex acoustic microscopy inspection system addresses this with ThruScan imaging and AI-powered analytics built for small-panel applications, debuting at SEMICON West 2026.
Advanced pulser and transducer technology allow scanning speeds up to 2x faster than conventional acoustic inspection systems, with a max imaging speed of 3.28 lines/s and max velocity of 5.9 ft/s (1.8 m/s). The system's modular architecture simplifies maintenance and serviceability, and scalable multi-system configurations can increase throughput by up to 8x.
FlexCore software, paired with Multi-Gate Image Analysis (MGIA), automatically identifies defects and isolates true void counts, supporting complex device and process analysis for deeper insight into production quality.
Applications
- Small-panel acoustic inspection
- Void, crack, and delamination detection
- Advanced packaging defect analysis
Industries
- Semiconductor manufacturing
- Advanced packaging
- Electronics manufacturing
Who It's For
- Back-end semiconductor manufacturers
- Quality and process engineers
- Advanced packaging fabs
Features:
- ThruScan imaging technology
- AI-powered defect detection via Multi-Gate Image Analysis (MGIA)
- Scanning speeds up to 2x faster than conventional systems
- Max imaging speed of 3.28 lines/s
- Max velocity of 5.9 ft/s (1.8 m/s)
- Modular architecture for simplified maintenance and serviceability
- Scalable multi-system configurations, increasing throughput up to 8x
- FlexCore software for acoustic echo analysis
Nordson Test & Inspection
Minneapolis, MN
(760) 918-8471
nordson.com