Power Pairings Advancing AI & Edge Computing: New Tech Collaborations From Lockheed Martin, LG Electronics, Microsoft, Aetina, and More

Generative AI in secure environments, private 5G testbeds, and on-prem edge computing are powering smarter industrial, mobility, and energy solutions.
Oct. 30, 2025
6 min read

Technology doesn't advance in isolation. In our 'Power Pairings' round-up series, we spotlight the partnerships that are advancing manufacturing—where companies from different domains, expertise, and technological backgrounds converge to solve industrial challenges or refine industrial solutions.


 

Lockheed Martin, Google Public Sector Bring Generative AI to Secure Defense Environments

Companies Involved: Lockheed Martin, Google Public Sector

At a Glance: Partnership integrates Google's Gemini AI models into Lockheed Martin's secure, on-premises AI Factory to advance applications in aerospace, cybersecurity, and space exploration.

Lockheed Martin and Google Public Sector have formed a strategic partnership to bring Google's generative AI, including its Gemini models, into Lockheed Martin's AI Factory—an advanced, on-premises computing environment designed for defense and aerospace applications. The integration allows engineers and analysts to use AI-powered tools within air-gapped systems that meet strict security and mission assurance requirements.

The phased rollout will first introduce Google's AI capabilities to Lockheed Martin's unclassified environments, followed by deployment within classified systems. These tools will support faster data analysis, improved logistics planning, and accelerated research and development for applications in aerospace, cybersecurity, and space exploration.

By combining Google's AI technology with Lockheed Martin's secure infrastructure, the collaboration shows how edge-based generative AI can be safely deployed in defense and industrial settings—bringing cloud-scale intelligence to environments that demand the highest levels of data protection.
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Everged, Betacom, LG Electronics, and University of Alabama Partner on AI-Driven 5G Testbed for Next-Gen Mobility

Companies Involved: Everged, Betacom, LG Electronics, Alabama Mobility & Power Center (University of Alabama)

At a Glance: Partnership creates a first-of-its-kind innovation environment combining private 5G, AI, and IIoT to advance autonomous mobility, EV charging, and smart grid systems.

Everged, Betacom, LG Electronics, and the Alabama Mobility & Power Center at the University of Alabama have joined forces to develop a cyber-secure, AI-enhanced testbed for the future of power and mobility. Built on a stand-alone 5G ORAN network developed by LG, the environment integrates artificial intelligence (AI), industrial IoT (IIoT), and advanced smart power systems to support real-world testing of autonomous charging, smart grid management, and next-generation transportation.

Located on the University of Alabama campus, the site will serve as a proving ground for emerging Industry 4.0 use cases spanning energy, manufacturing, and autonomous robotics. Everged brings expertise in smart power systems, while Betacom contributes its private 5G technology. Together, they're creating a high-performance, secure, and scalable platform that can connect thousands of devices and maintain reliability under demanding industrial conditions.

The collaboration expands the university's research capacity while providing students, faculty, and industry partners with access to state-of-the-art 5G and AI tools. By combining secure edge connectivity with smart power technologies, the project aims to accelerate the development of more resilient and efficient mobility infrastructure—bridging the gap between academic innovation and real-world industrial deployment.
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Aetina and Qualcomm Deliver On-Prem Edge AI Solutions

Companies Involved: Aetina Corporation, Qualcomm Technologies, Inc.

At a Glance: Aetina and Qualcomm are advancing edge AI with a new on-premises solution that combines Qualcomm’s inference accelerators with Aetina’s hardware to deliver powerful, energy-efficient AI computing for industrial applications.

Aetina Corporation, a provider of edge AI solutions and a subsidiary of Innodisk Group, has partnered with Qualcomm Technologies, Inc. to integrate Qualcomm’s AI inference accelerators and software into its edge computing systems. The result is a turnkey, enterprise-grade AI platform that supports high-performance on-premises applications in manufacturing.

The flagship system, Aetina MegaEdge AIP-FR68, incorporates Qualcomm’s Cloud AI 100 Ultra accelerator cards, delivering 870 TOPS of AI computing power with just 150 W of power consumption. The compact desktop form factor supports two accelerator cards, enabling businesses to run advanced AI models locally while maintaining data privacy and cloud-level performance. Applications include generative AI using large language models (LLMs) with Retrieval-Augmented Generation (RAG), allowing organizations to develop and test AI capabilities on-site with the ability to scale to private or cloud infrastructure.

Univers Launches Global Impact AI Lab to Accelerate Edge and Energy Innovation

Companies Involved: Univers, AMD, Microsoft, National University of Singapore (NUS)

At a Glance: New AI lab brings together leading tech and research partners to fast-track edge-to-cloud solutions for energy, infrastructure, and industrial applications.

Univers, a global leader in AI for energy and industrial systems, has launched the Global Impact AI Lab (IAL) in partnership with AMD, Microsoft, and the National University of Singapore. Supported by Singapore's Infocomm Media Development Authority, the lab aims to accelerate large-scale AI and IoT innovation across energy, infrastructure, manufacturing, and transportation sectors.

The IAL will incubate edge-to-cloud solutions that improve efficiency on three fronts: energy, operations, and systems. Projects will focus on optimizing energy use, connecting and automating industrial assets, and uniting digital ecosystems through AI-driven orchestration.

Each partner brings specialized expertise: AMD delivers real-time, secure AI processing at the edge; Microsoft integrates cloud-based AI and infrastructure optimization; and NUS provides research and talent development to bridge academia and industry. Together, the collaboration offers a practical pathway for turning advanced AI concepts into scalable, real-world solutions.

By combining AI, IoT, and high-performance computing, the Global Impact AI Lab is designed to help enterprises operate smarter, faster, and more sustainably—showcasing how edge intelligence can drive measurable gains in both efficiency and innovation.
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Fuji America and Cybord to Advance AI Component Inspection for SMT Manufacturing

Companies Involved: Cybord, Fuji America Corporation

At a Glance: AI-powered component analytics from Cybord have been integrated into Fuji America's SMT equipment, enhancing electronic component quality assurance, reducing recalls, and improving traceability for manufacturers.

Cybord, a provider of AI-powered component analytics, has entered a partnership with Fuji America Corporation, a leader in surface mount technology (SMT) equipment, becoming one of Fuji's preferred tech partners. The collaboration enables Fuji America to incorporate Cybord’s visual AI inspection solution directly into SMT lines, providing real-time analysis of 100% of electronic components during printed circuit board assembly (PCBA).

The partnership addresses rising concerns over faulty, damaged, or counterfeit electronic components in increasingly strained supply chains. With product recalls expected to surge, the joint solution provides manufacturers with traceability and defect detection at 99.9% accuracy using a database of nearly 5 billion components. By integrating Cybord’s AI system into Fuji America’s SMT equipment, manufacturers can reduce rework and scrap, minimize recall risk, and improve overall product quality and operational efficiency.

About the Author

Laura Davis

Editor-in-Chief, New Equipment Digest

Laura Davis is the editor in chief of New Equipment Digest (NED), a brand part of the Manufacturing Group at EndeavorB2B. NED covers all products, equipment, solutions, and technology related to the broad scope of manufacturing, from mops and buckets to robots and automation. Laura has been a manufacturing product writer for eight years, knowledgeable about the ins and outs of the industry, along with what readers are looking for when wanting to learn about the latest products on the market.

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