Heatsink Fillers and Passive Heatsinks for Electronic Housings

Phoenix Contact has increased the breadth and depth of its Industrial Case System (ICS) housing family to include customizable passive heatsinks and heatsink fillers. Advanced components combined with tighter spaces have put increasing thermal demands on electronic housings. New heatsink solutions now allow design engineers to choose from a wide range of thermal management solutions to keep their components from overheating.

Passive heatsinks and space-saving heatsink fillers are available in ICS housing widths of 25 and 50 mm. The position of the heatsink base can vary, making it possible to connect electronic components with an installed height of up to 13 or 15 mm. The clearance between the PCB and the heatsink base ranges between 0 and 11 mm to meet different space requirements. The heatsink can be custom-designed and manufactured to meet the specific layout of the electronics. This ensures optimum heat dissipation in the enclosure and a longer service life of the electronic components.

To support the new heatsink solutions, a web-based, intuitive platform for thermal assessment has been incorporated into the Electronic Housing Online Configurator tool on Phoenix Contact’s website. Here, designers can customize enclosures and, on request, be provided with individual thermal management consultation. Device developers receive a detailed, application-specific simulation and recommendations for the appropriate housing selection, heatsink design, and heatsink arrangement.