0615CDMCC/DS Power Inductor Offers High Current and Low Noise

Sumida's 0615CDMCC/DS power inductor series provides EMI shielding and thermal stability in compact footprints for dense electronics.
Jan. 28, 2026
2 min read

Sumida's 0615CDMCC/DS series low-profile molded power inductor is for compact computing devices, servers, and DC/DC converter architectures. The series features metal compound molding construction, embedding the winding in a solid composite core to eliminate internal air gaps and improve magnetic flux containment. This allows higher current capability and stable inductance as load current increases. Low DC resistance reduces conduction losses, supporting efficient power conversion in constrained power budgets.

The molding process produces a shielded magnetic structure, minimizing electromagnetic interference (EMI) and magnetic flux leakage into nearby circuitry. This makes the inductor suitable for noise-sensitive applications, including high-speed digital boards, RF devices, and distributed power rails.

Composite construction also suppresses vibrational energy that can cause audible core noise, providing quiet operation for consumer, medical, and instrumentation equipment.

Despite its monolithic design, the inductor has a footprint of 0.29 × 0.27 × 0.06 in (7.3 × 6.8 × 1.5 mm), which fits within mechanical envelopes with limited vertical space. It supports operation and storage temperatures from −67 to 257°F (−55 to 125°C).

Inductance values from 0.12 to 1.50 μH accommodate current-mode control and high-efficiency power designs. Standard carrier-tape packaging supports automated assembly for high-volume production.

The 0615CDMCC/DS series is available through Sumida's authorized distributors. Price in 10K quantity is US$0.256. Engineering samples, detailed electrical specifications, and PCB footprint recommendations are available from local Sumida representatives or online.

Features:

  • Metal compound molded construction
  • High current capability
  • Stable inductance under load
  • Low DC resistance for reduced conduction losses
  • Shielded magnetic structure for EMI control
  • Low audible core noise for quiet operation
  • Ultra-thin, compact footprint: 0.29 × 0.27 × 0.06 in (7.3 × 6.8 × 1.5 mm)
  • Operation and storage temperature: −67 to 257°F (−55 to 125°C)
  • Inductance range: 0.12 to 1.50 μH
  • Standard carrier-tape packaging for automated assembly

Sumida America, Inc.
Schaumburg, IL
(847) 545-6700
[email protected]
sumida.com

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