Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is well suited for bonding dissimilar substrates with different coefficients of expansion . As a lower viscosity system it is also well suited for potting, coating, and sealing electronics.
- Withstands rigorous thermal cycling
- Superior durability
- Low exotherm during cure
- Long working life
- Cures at ambient temperatures
- Withstands 1,000 hours 85°C/85% RH
