Receptacle Assembly;Vertical

Jan. 31, 2014
The MICTOR connector family is based on the micro-strip concept of two rows of signal contacts divided by a center power ground plane. MICTOR connectors are motherboard and daughtercard compatible and include designs for cable-to-board applications. Various mated heights are available for parallel board-to-board systems. Custom stacking heights can be provided. The MICTOR connector family is available in 0.64 mm centerlines in sizes ranging from 38- signal positions to 266-positions (in increments of 38-positions). There is a discrete ground bus every 12.7 mm of the connector length, which can be assigned to either power or ground in any combination. Redundant interfaces on every signal line provide added reliability. Several plating options are available to meet the needs of various applications. The housing material is a liquid crystal polymer, compatible with infrared and forced air convection operations. The connector system maintains a 50 ohm impedance and uses the solid ground bus between the rows of signals to provide low crosstalk and excellent high-speed signal characteristics. Features
  • 76 Dedicated Signal Lines Per Linear Inch
  • Surface-Mount Family Designed for Parallel Board-To-Board, Flex-To-Board and Cable-To-Board Configurations
  • 0.64 mm Centerline Contact Spacing
  • Redundant Interfaces on Mated Contacts
  • Infrared and Forced Air Convection Compatible Housing Materials
  • Designed for 50 Ohm Systems
  • Connector Housings Polarized for Correct Mating
  • Built-In Connector-To-Board Retention Feature
  • Connectors Can Be Unmated By Peeling from One End to the Other
  • Recognized UL, File No. E28476 and CSA, Certificate Number Lr 7189a-852

    Material Specifications
  • Housing: Liquid Crystal Polymer, Black
  • Contacts: High Reliability Copper Alloy
  • Ground Bus: Phosphor Bronze Finish (Gold Plating)
  • Contacts and Ground Bus: Duplex Plated 0.00076 Min. Gold in Mating Area, 0.00381 Min. Tin-Lead on Leads, with Entire Contact and Ground Bus Underplated 0.00178 Min. Nickel
  • Finish (Palladium-Nickel Plating)

    Performance Specifications
  • Voltage Rating: 30 VAC
  • Current Rating: Signal; 1.0 Amp Fully Derated, Ground; 7.6 Amp Fully Derated (Consult AMP for Details on Current Rating)
  • Temperature: –55°C to +125°C
  • Characteristic Impedance: 50 Ohms at 1 nSec.
  • Termination Resistance: 10 Milliohms Max.
  • Insulation Resistance: 10000 Megohms Max.
  • Dielectric Withstanding Voltage: 500 VAC at Seal Level
  • Color:Black | Contact Plating:Gold (30) over Nickel | Current, Rating:1 | Temperature, Operating:-55 to +125 | Primary Type:Board to Board | Length, Overall:1 | Number of Rows:2 | Type:PCB Socket | Material, Housing:LCP | Voltage, Rating:30 | Angle:Straight | Number of Contacts:38 | Length, Pin:0.055 | Agency Approvals:CSA, UL | Pin Spacing:0.025 | Material, Contact:Copper Alloy | Termination:Thru-Hole |