ACM Research's multi-product portfolio of tools supports IC and compound semi-manufacturing, wafer-level packaging, and wafer manufacturing. Its product offering supports a wide range of process steps, including single-wafer and batch wet cleaning, electroplating, thermal deposition, stress-free polishing, PECVD, and track.
ACM Research, Inc. was founded in California in 1998 to supply capital equipment to the global semiconductor industry. We conduct the majority of product development, manufacturing, support and services through our subsidiary ACM Research (Shanghai), formed by ACM Research in the People’s Republic of China in 2005. We perform additional product development and subsystem production in Incheon, South Korea, and we provide sales, marketing and advanced services coverage in North America, Europe and certain regions in Asia outside mainland China.
The Ultra Furnace is the first system developed for multiple dry-processing applications. Initially optimized to deliver high performance for low-pressure chemical vapor deposition...
The Ultra SFP tool for advanced packaging solutions is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging...
