Master Bond: Breaking Through the Walls of Thermal Management [VIDEO]

July 22, 2015
Featuring high thermally conductive fillers, Master Bond EP48TC is a two component epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. It complies with NASA low outgassing specifications and can be used in applications in a variety of high-tech industries.