EP3UF-1 Epoxy Delivers Unlimited Working Life

March 15, 2019
Master Bond's epoxy is for bond lines as thin as 10 to 15 microns.

Master Bond EP3UF-1 is a single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000 to 15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000 to 20,000 psi and a tensile modulus of 450,000 to 500,000 psi.


EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], making it an effective thermal interface material. It contains a special filler with a small particle size. This allows it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen), both measured at 75°F.


As a single component system, EP3UF-1 is more convenient to handle, apply and store than typical two-component adhesive systems. It has an unlimited working life at room temperature and cures in 20-30 minutes at 250°F, or in 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems.
For more information on EP3UF-1, request a technical data sheet.