Mars MA3 SoC Module for Any Circumstance

Sept. 21, 2018
The module series from Enclustra offers up to 154,000 systems logic cells.

Mars MA3 presents the most powerful SoC module based on the Xilinx Zynq UltraScale+ MPSoC in the Mars form factor. It features up to 6 ARM cores, a Mali 400MP2 GPU, up to 4 GByte of extremely fast DDR4 SDRAM, numerous standard interfaces, 108 user I/Os, and up to 154,000 LUT4 equivalents.


The module provides a quick and easy introduction to the Xilinx Zynq UltraScale+ MPSoC technology. It comes in the extremely compact and well-established SO-DIMM form factor and is optimized for applications that require the greatest processing power possible in the smallest of spaces, without having to make any compromises when it comes to functionality.


The series offers up to 154,000 systems logic cells, 108 user I/Os, up to 6 ARM processors, a Mali 400MP2 GPU (only EG variants), up to 4 GByte of ultra-fast DDR4 SDRAM, 64 MByte QSPI flash memory, 16 GByte eMMC flash memory as well as Gigabit Ethernet and USB 2.0/3.0 ports, all on a surface area measuring just 67.6 × 30 mm. A heat sink developed for the Mars XU3 is available for optimum heat dissipation. Its compact design (less than 7 mm in height) and a mounting slot in the center of the heat sink make it easy to attach fans of different sizes. The Mars XU3 SoC module has a planned availability of 10 years.


Enclustra offers broad design-in support for their products. With the Mars EB1 baseboard, the Mars XU3 is a powerful development and prototyping platform.


Enclustra also offers a comprehensive ecosystem for the Mars XU3, offering all the hardware, software, and support materials required. Detailed documentation and reference designs make it easy to get started, in addition to the user manual, user schema, a 3D-model (STEP), PCB footprint (Altium, OrCAD, PADS, EAGLE), and differential I/O length tables.


The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and baseboard are selected by a graphical interface. Afterward, the Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL), and the required source code. Finally, U-Boot, Linux, and the root file system, which is based on BusyBox, are compiled.


Thanks to the family concept with compatible connectors, different types of modules can be used on the same baseboard. If, for example, an ARM processor is not required, the Mars AX3 FPGA module can be used on the same baseboard instead.

  • Intel Cyclone V SoC
    • ARM dual-core Cortex-A9
      (32 bit, up to 800 MHz)
    • Intel Cyclone V 28nm FPGA fabric
  • SO-DIMM form factor
  • 104 user I/Os
    • 16 ARM peripherals (SPI, SDIO, CAN, I2C, UART) from which 14 pins shared with FPGA I/Os
    • 76 FPGA I/Os (single-ended or differential)
    • 12 MGT signals (clock and data) for SX devices or 4 additional FPGA I/Os for SE devices
  • Gigabit Ethernet and USB 2.0 OTG PHYs
  • Fast Ethernet PHY
  • Up to 2 x 3.125 Gbps MGTs
  • Up to 2 GB DDR3L SDRAM
  • 64MB quad SPI flash
  • 16GB eMMC flash
  • Single 3.3V supply voltage