Wireless Connectivity Module

Aug. 14, 2018

Bluetooth 5 series enables vital performance improvements with up to four times’ the range and twice the data throughput, opening product opportunities for industrial, medical, and Internet of Things (IoT) applications.


BL654 Series builds upon its field-proven BL600 and BL652 series, reducing engineering burden and design risk, and speeding time-to-market when integrating Bluetooth Low Energy (BLE), as well as Thread (802.15.4) and NFC capabilities into an OEM design.


In addition to the stand-out Bluetooth 5 features of enhanced data rates and LE Long Range, the BL654 also integrates BLE Mesh capabilities in a high TX power platform, providing innovative new application possibilities for low power, long-range mesh sensor networks.


Based on Nordic Semiconductor nRF52840 silicon, the BL654 ultra-small modules, development kits, and USB-packaged adapter provide a secure, robust, multi-wireless plus Cortex-M4F MCU platform for any product design. The BL654 delivers maximum development flexibility with programming options for the Nordic SDK in C; a simple, intuitive AT Command Set, as well as Laird’s smartBASIC event-driven programming environment.


Laird’s smartBASIC is a proven event driven programming language that makes integration easier for designers, especially those who may be new to Bluetooth wireless technology. The programming language offers built-in functions that replace thousands of lines of C code and allows designers to leverage Laird's years of Bluetooth expertise. It also acts as a bridge between software and hardware, allowing an application to work on any smartBASIC radio.


The BL654 is especially ideal for the IoT, where many companies may not have any background in RF design or BLE wireless technology, Lordo added. By using the BL654, they will be able to access the latest market-leading wireless technology without the steep learning curve, design risk, and time that it will typically involve.


The BL654 family also boasts robust security, industrial temperature rating, a tiny footprint -- as small as 15 x 10mm -- and modular FCC, IC, CE, MIC, RCM and Bluetooth SIG approvals, which extend to an OEM’s design with no new testing for the fastest route to production.