EP29LPSPAO-1 Black Epoxy Designed for Cryogenic Applications

Jan. 22, 2018
Master Bond Inc. has developed an epoxy specifically for cryogenic applications.

EP29LPSPAO-1 Black is a two component, thermally conductive, electrically insulating epoxy system for bonding, coating, sealing and potting. It has a forgiving 100 to 65 mix ratio by weight. After mixing, this epoxy is a smooth, free-flowing, thixotropic type system. It has very low exotherm and a long open time.


Most significantly, it is a special formulation designed for cryogenic applications. It is even able to withstand rapid excursions down to these low temperatures. It performs well even when temperatures go down to 4K in 5-10 minutes. After mixing, EP29LPSPAO-1 Black is cured for 12-24 hours at room temperature, followed by heating. The options for the heat curing portion of the schedule are summarized in the table below. The epoxy has very low shrinkage upon curing and after cure, it is highly dimensionally stable.


EP29LPSPAO-1 Black bonds well to a wide variety of substrates such as metals, glass, ceramics and composites. The combination of good flow, thermal conduction and electrical isolation, enable it to be useful in potting and encapsulating applications. The color of Part A is black and Part B is off white. The service temperature range is from 4K to +250°F.


This epoxy has a good resistance to water, oils and hydraulic fluids as well as some acids and bases. This epoxy is particularly useful in aerospace, optical, electronic, specialty OEM and other applications where cryogenic serviceability and the other special product properties mentioned above are desirable.


  • Low viscosity and good flow properties
  • Low exotherm; long working life
  • Serviceable down to 4K
  • Can withstand cryogenic shocks
  • Good thermal conductivity while retaining electrical insulation
  • Complies with NASA low outgassing specifications