EP21TDCSFL Two-Part, Silver Conductive Epoxy

Oct. 9, 2007

Master Bond EP21TDCSFL is a two-component, room temperature curing, silver filled, epoxy adhesive and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures. It can be applied on vertical surfaces with minimal sagging. This compound is 100% reactive and does not contain any diluents or solvents. EP21TDCSFL has a volume resistivity of <10-3 ohm-cm.


It offers mechanical shock resistance and low outgassing properties. Adhesion to metals, glass, ceramics, rubbers, and many plastics is excellent. It has a service operating temperature range of from 4K to +250°F. Additionally, EP21TDCSFL is particularly recommended for bonding dissimilar substrates that are being thermally cycled and shocked. It has inherently low shrinkage which enables the cured system to exert very little mechanical stress on sensitive components and substrates. EP21TDCSFL has a tensile shear strength of >1,500 psi and a T-peel of >30 pli. It has a thermal conductivity of 11 BTU/in/ft*/hr/°F. Highly flexible, EP21TDCSFL is well suited for repair applications. Parts A and B are both colored silver.

  • Low volume resistivity
  • High flexibility
  • Resists thermal cycling
  • Cryogenically serviceable
  • Excellent flow properties
  • Cures at room temperature