V30Z63MDP Series Soft Paste Thermal Gel

Aug. 31, 2010

The new soft paste-type thermal gel from Advanced Antivibration Components -  AAC features excellent thermal conductivity up to 6.5W/m • K. This RoHS-controlled substance is used to fill gaps around heat sources such as high-performance semiconductors. Other applications involve surface,  underside, and lead heat sources such as ICs. The paste is most popular for use where it is difficult to fix sheet-type thermal gel. These applications include computer internal components, power supplies,  power transistors, and other heat-producing components.


There are 3 types of gels, identified as the V30Z63MDP Series, which come in a syringe to make for easier application of the gel. High specific volume resistance ratio up to 7.2x1014 W • cm. Low dissipation factor down to 0.0004 at 1MHz. High breakdown voltage up to 9.6 kv/mm.  They contain nothing harmful and are therefore considered environment-friendly.