Low Density Epoxy…The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds.  This epoxy syntactic foam system utilizes technologically advanced micro balloons.  This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.  The option of selecting from three different curing agents allows end users to customize the physical properties they require. Key Features: •    Low Density •    Excellent electrical insulation •    Low shrinkage •    Low CTE (coefficient of thermal expansion) •    Excellent water resistance Samples are available.
  • epoxy syntactic foam system
  • low density, low coefficient of thermal expansions
  • low shrinkage