Low Density Epoxy…The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require. Key Features: • Low Density • Excellent electrical insulation • Low shrinkage • Low CTE (coefficient of thermal expansion) • Excellent water resistance Samples are available.
- epoxy syntactic foam system
- low density, low coefficient of thermal expansions
- low shrinkage
