Sensor Products Inc

300 Madison Ave
Madison, NJ 07940-1868
United States of America
973-884-1755

Products

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Sensor Products Inc. is pleased to announce it is offering Fuji Prescale® pressure film. For more than 20 years Sensor Products Inc. has been a leader in the field of tactile ...
March 18, 2011
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Mold-Align® is a new tool from Sensor Products Inc.  that  helps improve yields and reduce defects in the injection molding process.  When placed between mold halves...
Dec. 22, 2010
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The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables engineers to quickly and precisely test and correct the surface contact and pressure distribution between...
Sept. 2, 2010
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Sensor Products Inc. introduces DigiNip®, an economical hand-held device that transforms the way nip measurements are obtained for small printing, coating, laminating and production...
June 29, 2010
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In design engineering for squeezable tubes and flexible packaging, habits of the end user can now be evaluated quantitatively with Tactilus® surface pressure mapping technology...
March 17, 2010
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Sensor Products Inc. introduces Mini Sigma-Nip® for converting and printing/packaging, an electronic nip analysis system which measures roller profiles and diagnoses roll alignment...
Dec. 4, 2008
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Sensor Products Inc. announces Pressurex Zero®, the newest addition to its tactile pressure-indicating sensor films. Eagerly awaited by the engineering community, Pressurex Zero...
Dec. 3, 2008
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Sensor Products Inc. offers its Tactilus® line of dynamic electronic pressure-mapping systems to the packaging industry. This innovative device allows measurement of contact pressures...
May 14, 2008
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Sensor Products LLC announces the expansion of its Tactilus® line of dynamic electronic pressure mapping systems with the introduction of its free form sensor systems. The systems...
June 13, 2006
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Thermex is an economical temperature-sensitive indicator paper that reveals a relative temperature and pressure profile from 200 to 300°F. The paper turns a light blue at the ...
Nov. 23, 2005