NOTABLE QUOTE
“The concept behind three-dimensional advanced packaging is to stack multiple dies or wafers vertically to achieve better performance with lower power requirements, smaller size, and lower cost. However, as three-dimensional packages become increasingly complex, so do the challenges in identifying defects within vertically stacked, multiple layers. Now, the focus is shifting to methods of non-destructive testing like Scanning Acoustic Microscopy." — Hari Polu, President of PVA TePla OKOS, a Virginia-based manufacturer of SAM and industrial ultrasonic non-destructive (NDT) systems.
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