Master Bond: Breaking Through the Walls of Thermal Management [VIDEO]

Featuring high thermally conductive fillers, Master Bond EP48TC is a two component epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 Km2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTUin/ft2hrF [2.88-3.60 W/(mK)]. It complies with NASA low outgassing specifications and can be used in applications in a variety of high-tech industries.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish