Supporting solid and liquid precursors required in semiconductor manufacturing, GF120xHT Series high-temperature thermal mass flow controller operates between 113 and 302°F (45 and 150°C).
With its greater operating range than conventional thermal MFCs, the GF120xHT can deliver vapor to the process chamber, even when that material is a liquid or a solid at room temperature.
It has ultrafast EtherCAT communication, programmable alarms and warnings developed for advanced process control, and fault detection and classification (FDC) tracking.
To support high-temperature applications, the electronics are remotely connected to the mechanical flow module of the GF120xHT Series. The flow module can operate at temperatures up to 150°C, while the remote electronics are mounted in a cooler location (<50°C).
Each device is sized and calibrated to each customer's configuration based on their operating temperature, pressures, and mounting orientation.
The remote electronics are offered with a range of communication protocols (analog, DeviceNet and EtherCAT), along with a standard din rail for ease of mounting. The flow module also supports a variety of fitting options, ensuring compatibility with current and future equipment designs. In addition, 3 cable lengths are available for connecting the remote electronics to the flow module to support various applications.
Features:
- Designed for high-temperature applications up to 150°C
- Convenient service port provides access to diagnostics via user-friendly interface
- Corrosion-resistant Hastelloy sensor
- Calibrated to the customer's process conditions
- Ability to support applications up to 150°C for liquid precursor vapor delivery
- User-friendly diagnostics interface supports process engineer in ensuring MFC is operating within the specified limits for high-yield and maximum uptime
- Provides unmatched long-term sensor stability for maximum throughput and yields
- Calibrated at customer operating temperature and pressure for optimal performance
Applications/Industries:
- Advanced Strip Processes
- Atomic Layer Deposition (ALD)
- Deposition
| Flow Range (Full Scale Capacity) | 50 sccm to 5 slm (N2 equivalent) |
| Accuracy | ±1% SP >35 to 100%; ±0.35% FS 2 to 35% |
| Repeatability | <±0.15% SP |
| Response Time | Normally Closed Valve: <1 sec |
| Seal Material | Metal |
| Level of Purity/Surface Finish | 5 µ in. Ra avg |
| Max. Temp. | 302°F (150°C) |
| Max. Pressure | 500 psia |
| Diagnostic Capability | Available |
| Analog Communication | 0 to 5V DC |
| Digital Communication | DeviceNet, EtherCAT, RS-485 L-Protocol |
Brooks Instrument
Hatfield, PA
(888) 554-3569
[email protected]
www.brooksinstrument.com
