Samtec, Inc. announces the release of its new 2013 Interconnect Solutions Catalog. This newest edition includes a number of new products and new product features designed for routing signals in high speed and high power applications where signal integrity, rugged environments and/or space constraints present design challenges. The 2013 Catalog details Samtec’s comprehensive line of interconnects which includes Signal Integrity, Micro and Rugged solutions for Board-to-Board, Cable, and Panel & I/O applications.
Samtec is continually expanding its product line to meet or exceed current technology and industry demands. New products include high density and high power interconnects with a low profile design and high speed cable assemblies designed to reach longer distances and aid the transition to optical systems. New product features provide more rugged solutions with the screw down option for Tiger Eye™ cable and board stacking systems and increased system flexibility with an expanded offering of components and field termination kits for discrete wire and sealed I/O cable assemblies.