Low Density Epoxy…The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds.  This epoxy syntactic foam system utilizes technologically advanced micro balloons.  This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.

This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.  The option of selecting from three different curing agents allows end users to customize the physical properties they require.

Key Features:
•    Low Density
•    Excellent electrical insulation
•    Low shrinkage
•    Low CTE (coefficient of thermal expansion)
•    Excellent water resistance
Samples are available.