To simplify silicone ingot bonding and protect against wafer breakage, Henkel Corporation has introduced Loctite® 3382(TM), a water-debondable epoxy adhesive that provides excellent bond strength to both silicon and the glass and metal mounting substrates used during the ingot sawing process. Loctite® 3382(TM) replaces traditional epoxies that require caustic acids for debonding.  This adhesive breaks down easily on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during the wafer cleaning process. 

As this two-part epoxy is pink when cured, it is easy to distinguish from the silicon ingot and the metal and glass mounting substrates during visual inspections.  Easy to dispense using meter-mix equipment, Loctite® 3382(TM) is packaged in cartridges, pails and drums.  This adhesive emits no caustic odor, will not corrode equipment, and is fully-compatible with current wafer cleaning solutions and processes.

Homogenous and stable, Loctite® 3382(TM) sets up in just 5 to 7 hours and provides a consistent cutting layer that reduces edge damage and wafer breakage.  This epoxy's excellent bond strength means the adhesive will not prematurely debond during the sawing process, protecting the ingot and the wafers from damage.