Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21LV has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigid cure (enhanced machinability) while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure (greater impact resistance). The EP21LV produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21LV is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. As a Class VI epoxy, EP21LV has a wide range of uses as an adhesive, sealant or coating in the medical industry. In addition, it meets FDA requirements for food compatibility. EP21LV contains no solvents or diluents. While the standard color of the cured material is amber-clear, a wide variety of additional color choices are also available.