Epoxies, Etc. introduces the 20-2180, a Polyurethane Potting and Encapsulating Resin that has fitting properties for cable and harness assemblies.  The 20-2180 can be poured into a metal or silicone mold to create an assembly with a firm seal aroun...

Epoxies, Etc. offers a new silicone potting and encapsulating compound with a convenient 1:1 mix ratio.  The 50-1952 is specially formulated for quick thermal transfer away from heat generating electronic devices.  With its high operating temp...

Epoxies, Etc. develops a high performance two part silicone system.  50-1225 is designed for electronic packages that require good flow around components, high thermal conductivity, ability to sustain environmental extremes, and cushioning for sens...