A cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity called EP11SIC has been developed by Master Bond, Inc., Hackensack NJ. It offers the application convenience of a one component system which does not require mixing before use in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a  tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi. EP11SIC is amazingly tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50°C to over 150°C (-60°F to 300°F).  Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste. The gel time at 150°C is in the order of 20-25 minutes while cure is on the order of 40-50 minutes at 175°C (345°F).  Typical performance properties include a very low volume resistivity less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square and a very robust thermal conductivity of 7.9 W/meter-°K (55 BTU/in/hr/ft2/°F). Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions. Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.