High-Fill/Flow Circuit Board Material
Supplier: Rogers Corp. Part Number RO4450-dx
Circuit material, known as RO4450B-dx Bondply, is a glass-reinforced hydrocarbon/ ceramic thermoset bondply designed for performance-sensitive multilayer printed circuit boards. The low-loss material is designed to fill high-density designs while still offering thin dielectric spacing.
Rogers Corp., Rogers, CT
Reviews & Comments
Be the first to leave a review.
Leave your review
Your review will be reviewed and appear online within one to two business days.
Please add your email address if you would like to be entered in the prize giveaway!
Note that your Job title will be displayed with your review. Your email will NOT be displayed.
Part Number R/? ex JADE® A Series
Rogers Corporation (NYSE: ROG) is introducing R/flex JADE™ series flexible circuit materials, which are the next generation of the industry-leading R/flex CRYSTAL® epoxy adhesive system. Environmentally friendly, these materials meet flammability requireme...
|
Poron Soft Seal foam provides dust sealing and gap filling within sensitive electronic enclosures, particularly those with LCDs and other user interfaces. Conformability of the material allows the gasket to adjust to varying contours and gap thicknesses, w...
|
A new, patented safety chain lanyard with dual spring hangers that offset the weight of a heavy tool to facilitate alignment and improve operator safety has been introduced by ESCO Tools. The MILLHOG® ET-800 Dual Spring Hanger with an integral safety c...
|
|
|
advertisement
|