Part Number SM43HT
Master Bond Steelmaster 43HT is a high performance, stainless steel filled two component epoxy resin system for the cost effective repair, maintenance, rebuilding, restoring and resealing of worn or damaged metallic components. It is formulated to cure rapidly at room temperature and features a convenient 5 to 1 mix ratio by weight. It is easily mixed and applied with minimal sagging. This unique epoxy resin system develops high physical strength properties and exhibits excellent adhesion to many substra......

View Full Product Details >>

Part Number EP21ANHT
Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft2 •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide var......

View Full Product Details >>

Part Number EP24
Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, weight or volume. It quickly develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable, tough and high strength bonds which are remarkably resistant ......

View Full Product Details >>

Part Number EP21LV
Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21LV has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigi......

View Full Product Details >>

Part Number EP21HT
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durable bonds that hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21HT possesses superb physical strength properties along with b......

View Full Product Details >>

Part Number EP21FL
Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is well suited for bonding dissimilar substrates with different coefficients of expansion . As a lower viscosity system it is also wel......

View Full Product Details >>

Part Number EP21TDCS
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 850 psi tensile shear and a T-peel of greater than 10 pli when measured and cured at 75°F . It is 1......

View Full Product Details >>

Part Number EP21AR
Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient two-to-one non-critical mix ratio by weight, offers unsurpassed acid resistance. It can successfully withstand, for example, prolonged immersion in even 96-98% sulfuric......

View Full Product Details >>

Part Number EP65HT-1
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 ......

View Full Product Details >>

Part Number EP37-3FLF
Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and ......

View Full Product Details >>