Flextronics Unveils Product Innovation Center in Silicon Valley
Issue: February 2013, Posted Date: 2/15/2013
The facility has 3-D printing, surface-mount and X-ray equipment to support its customers' product-development efforts.
Flextronics, a provider of design, engineering and manufacturing services, recently unveiled its new product innovation center in Milpitas, Calif.
The facility includes "the most advanced 3-D plastic printing, surface-mount technology, X-ray and test equipment to support major industries in bringing innovative products to market rapidly," the company said in a news release.
The center also features "dedicated customer-confidential workspaces that include increased security and restricted access to protect OEM customers' intellectual property and confidentiality of new products being launched into the marketplace," the company said.
Flextronics plans to invest an additional $20 million in the center to expand its capabilities in 3-D metal printing, CNC machining, anodizing, advanced automation, microelectronics packaging and RF technologies, the company noted.
"Flextronics is committed to providing our OEM customers with advanced innovative solutions and offerings that increase their competitiveness and time to market," CEO Mike McNamara said.
Flextronics is based in Singapore and has its U.S. headquarters in San Jose, Calif.