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YESTech Announces New X1 Automated X-Ray Inspection System. This versatile system offers electronic manufacturers and semiconductor packagers advanced inspection capability of solder joints and critical hidden features. The x-ray images of solder joints are automatically analyzed to detect structural defects such as insufficient solder, voiding, shorts, and opens that typically account for up to 90% of the total defects on a complicated board.
YESTech, a leading supplier of automated optical and x-ray inspection systems for the electronics industry, introduces its new B3 benchtop automated optical inspection system for populated printed circuit boards.
YTX-6000 automated x-ray inspection (AXI ) system offers semiconductor packagers complete inspection of critical hidden features and its advanced inspection algorithms provide fast and complete inspection of PCBs and other electronic assemblies.
High-speed F1 automated optical inspection system provides inspection of solder and lead defects, component presence and position, correct part, polarity, and through-hole parts for improved quality.
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